1. Grain boundary diffusion in bilayered Ag/Cu thin film under diffusion-induced and intrinsic stresses. (8th March 2021) Authors: Lian, Songyou; Xu, Congkang; Wang, Jiangyong; Swart, Hendrik C; Terblans, Jacobus J Journal: Physica scripta Issue: Volume 96:Number 5(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Molecular dynamics simulation and thermodynamics calculation on surface segregation in Ni-Cu nano-films under stress. (1st October 2022) Authors: Lian, Songyou; Wang, Jiangyong; Swart, Hendrik C; Terblans, Jacobus J Journal: Physica scripta Issue: Volume 97:Number 10(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗