Author/Creator: Tőkei, Zsolt - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Tőkei, Zsolt

1. A novel electromigration characterization method based on low-frequency noise measurements. (6th June 2019)

Authors:: Beyne, Sofie; Pedreira, Olalla Varela; Wolf, Ingrid De; Tőkei, Zsolt; Croes, Kristof
Journal:: Semiconductor science and technology
Issue:: Volume 34:Number 7(2019)
Page Start:
Record Type:: Journal Article
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2. Design considerations for the mechanical integrity of airgaps in nano-interconnects under chip–package interaction; a numerical investigation. (April 2016)

Authors:: Zahedmanesh, Houman; Gonzalez, Mario; Ciofi, Ivan; Croes, Kristof; Bömmels, Jürgen; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 59(2016)
Page Start:: 102
Record Type:: Journal Article
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3. Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. (January 2016)

Authors:: Ključar, Luka; González, Mario; De Wolf, Ingrid; Croes, Kristof; Bömmels, Jürgen; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 56(2016)
Page Start:: 93
Record Type:: Journal Article
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4. Evaluation of via density and low-k Young's modulus influence on mechanical performance of advanced node multi-level Back-End-Of-Line. (January 2016)

Authors:: Ključar, Luka; González, Mario; De Wolf, Ingrid; Croes, Kristof; Bömmels, Jürgen; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 56(2016)
Page Start:: 93
Record Type:: Journal Article
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5. Impact of via density and passivation thickness on the mechanical integrity of advanced Back-End-Of-Line interconnects. (December 2017)

Authors:: Ključar, Luka; González, Mario; Croes, Kristof; De Wolf, Ingrid; De Messemaeker, Joke; Murdoch, Gayle; Nolmans, Philip; De Vos, Joeri; Bömmels, Jürgen; Beyne, Eric; Tőkei, Zsolt
Journal:: Microelectronics and reliability
Issue:: Volume 79(2017)
Page Start:: 297
Record Type:: Journal Article
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