1. Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond. (19th November 2014) Authors: Gao, Shan; Smith, Ryan Scott; Cho, Jae Kyu; Choi, Seungman; Kannan, Sukeshwar; Chua, Engchye; Geisler, Holm; Kuechenmeister, Frank Journal: ECS journal of solid state science and technology Issue: Volume 4:Number 1(2015) Page Start: N3134 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond. (1st January 2015) Authors: Gao, Shan; Smith, Ryan Scott; Cho, Jae Kyu; Choi, Seungman; Kannan, Sukeshwar; Chua, Engchye; Geisler, Holm; Kuechenmeister, Frank Journal: ECS journal of solid state science and technology Issue: Volume 4:Number 1(2015) Page Start: N3134 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗