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You searched for: Author/Creator Sim, K.S.Limit your search
- Sim, K.S. [remove] 5
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- Al -- PdCu -- hardness -- bond pad thickness -- mechanical cross‐section -- bond pad metallisation -- focus ion beam -- bond pad structure -- design of experiment -- back end wire bond process -- front end pad metal process -- semiconductor devices -- bond failure -- pad peeling -- bond force -- aluminium splash -- bond pad splash -- wire bonding 1
- Appareils électroniques -- Fiabilité -- Périodiques 1
- Biliary tract -- Diseases -- Periodicals 1
- Electronic apparatus and appliances -- Reliability 1
- Electronic apparatus and appliances -- Reliability -- Periodicals 1