1. Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring in-depth and the Lateral Distributions for Different Cutting Parameters. Issue 1770 (2015) Authors: Sopori, Bhushan; Devayajanam, Srinivas; Basnyat, Prakash; Schnepf, Rekha; Sahoo, Santosh; Gee, James; Severico, Ferdinando; Seigneur, Hubert; Schoenfeld, Winston V.; Preece, Steve; Binns, Jeff; Appel, Jesse; VanSant, Kaitlyn Editors: Hekmatshoar, B.; Collins, R.; Holman, Z.; Stradins, P.; Terakawa, A. Journal: MRS proceedings Issue: Issue 1770(2015) Page Start: 61 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗