1. Novel high-density interconnection technology for the CBM Silicon Tracking System. (30th September 2019) Authors: Pfistner, P.; Blank, T.; Caselle, M.; Wintzingerode, P.F. v.; Weber, M.; Heuser, J.M.; Schmidt, C.J. Journal: Journal of instrumentation Issue: Volume 14:Number 9(2019) Page Start: P09027 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗