Novel high-density interconnection technology for the CBM Silicon Tracking System. (30th September 2019)

Record Type:: Journal Article
Title:: Novel high-density interconnection technology for the CBM Silicon Tracking System. (30th September 2019)
Main Title:: Novel high-density interconnection technology for the CBM Silicon Tracking System
Authors:: Pfistner, P.
Blank, T.
Caselle, M.
Wintzingerode, P.F. v.
Weber, M.
Heuser, J.M.
Schmidt, C.J.
Abstract:
Is Part Of:: Journal of instrumentation. Volume 14:Number 9(2019)
Journal:: Journal of instrumentation
Issue:: Volume 14:Number 9(2019)
Issue Display:: Volume 14, Issue 9 (2019)
Year:: 2019
Volume:: 14
Issue:: 9
Issue Sort Value:: 2019-0014-0009-0000
Page Start:: P09027
Page End:: P09027
Publication Date:: 2019-09-30
Subjects:: Scientific apparatus and instruments -- Periodicals
502.84
Journal URLs:: http://iopscience.iop.org/1748-0221 ↗
http://ioppublishing.org/ ↗
DOI:: 10.1088/1748-0221/14/09/P09027 ↗
Languages:: English
ISSNs:: 1748-0221
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store
Ingest File:: 12016.xml