Author/Creator: Oppermann, H. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Oppermann, H.

1. 3D TSV hybrid pixel detector modules with ATLAS FE-I4 readout electronic chip. (1st January 2022)

Authors:: Fritzsch, T.; Huegging, F.; Mackowiak, P.; Zoschke, K.; Rothermund, M.; Owtscharenko, N.; Pohl, D.-L.; Oppermann, H.; Wermes, N.
Journal:: Journal of instrumentation
Issue:: Volume 17:Number 1(2022)
Page Start:
Record Type:: Journal Article
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2. Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding. (November 2022)

Authors:: Elsotohy, M.; Froehlich, J.; Dietrich, L.; Oppermann, H.; Schneider-Ramelow, M.
Journal:: Microelectronics and reliability
Issue:: Volume 138(2022)
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Record Type:: Journal Article
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3. Investigation of low temperature bonding process using indium bumps. (12th November 2018)

Authors:: Fritzsch, T.; Kavianpour, F.; Rothermund, M.; Oppermann, H.; Ehrmann, O.; Lang, K.-D.
Journal:: Journal of instrumentation
Issue:: Volume 13:Number 11(2018:Nov.)
Page Start:: C11007
Record Type:: Journal Article
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