Investigation of low temperature bonding process using indium bumps. (12th November 2018)

Record Type:: Journal Article
Title:: Investigation of low temperature bonding process using indium bumps. (12th November 2018)
Main Title:: Investigation of low temperature bonding process using indium bumps
Authors:: Fritzsch, T.
Kavianpour, F.
Rothermund, M.
Oppermann, H.
Ehrmann, O.
Lang, K.-D.
Abstract:
Is Part Of:: Journal of instrumentation. Volume 13:Number 11(2018:Nov.)
Journal:: Journal of instrumentation
Issue:: Volume 13:Number 11(2018:Nov.)
Issue Display:: Volume 13, Issue 11 (2018)
Year:: 2018
Volume:: 13
Issue:: 11
Issue Sort Value:: 2018-0013-0011-0000
Page Start:: C11007
Page End:: C11007
Publication Date:: 2018-11-12
Subjects:: Hybrid detectors -- Solid state detectors -- X-ray detectors
Scientific apparatus and instruments -- Periodicals
502.84
Journal URLs:: http://iopscience.iop.org/1748-0221 ↗
http://ioppublishing.org/ ↗
DOI:: 10.1088/1748-0221/13/11/C11007 ↗
Languages:: English
ISSNs:: 1748-0221
Deposit Type:: Legaldeposit
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗
Physical Locations:: British Library DSC - BLDSS-3PM
British Library HMNTS - ELD Digital store
Ingest File:: 11079.xml