1. Heat dissipative Pb-free bonding technology using Al-rich Zn/Al/Zn clad solder*. Issue 11 (2nd November 2017) Authors: Yamaguchi, Takuto; Tohei, Tomotake; Ikeda, Osamu; Hata, Shohei; Oda, Yuichi; Kuroki, Kazuma; Kuroda, Hiromitsu; Hirose, Akio Journal: Welding international Issue: Volume 31:Issue 11(2017) Page Start: 846 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗