Heat dissipative Pb-free bonding technology using Al-rich Zn/Al/Zn clad solder*. Issue 11 (2nd November 2017)

• Record Type: Journal Article
• Authors: Yamaguchi, Takuto; Tohei, Tomotake; Ikeda, Osamu; Hata, Shohei; Oda, Yuichi; Kuroki, Kazuma; Kuroda, Hiromitsu; Hirose, Akio
• Is Part Of: Welding international. Volume 31:Issue 11(2017)
• Page Start: 846
• Page End: 856
• Publication Date: 2017-11-02
• Subjects: Zn-Al -- antioxidation -- die bonding -- Pb-free solder -- clad material -- SiC; Welding -- Periodicals; Welding -- Automation -- Periodicals; 671.52
• DOI: 10.1080/09507116.2016.1223227
• Languages: English
• ISSNs: 0950-7116

Abstract

Abstract: Al-rich Zn/Al/Zn clad solder were developed as Pb-free solder for a die-attachment. The Zn/Al/Zn clad solder was produced by clad rolling of Zn and Al strips in order to prevent Al from oxidation and improve wettability. The Zn/Al/Zn clad solder was melted at 382°C after solid-state interdiffusion of the Zn and Al layers. Bonding was successfully achieved with bonding pressure of a few kilopascals. Thermal cycle life of Invar-to-Cu substrate joint using the Zn/Al/Zn clad solder was longer than that of Pb-Sn-Ag solder. No Kirkendall voids were observed in the vicinity of the bonded interface after ageing at 250 °C for 1000 h.