1. Comparative Study of the Scaling Effect on Pressure Profiles in Capillary Underfill Process. (May 2017) Authors: Ng, Fei Chong; Abas, Aizat; Abdullah, M Z; Ishak, M H H; Chong, Gean Yuen Journal: IOP conference series Issue: Volume 203(2017) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. CUF scaling effect on contact angle and threshold pressure. Issue 4 (4th September 2017) Authors: Ng, Fei Chong; Abas, Mohamad Aizat; Abdullah, MZ; Ishak, MHH; Chong, Gean Yuen Journal: Soldering & surface mount technology Issue: Volume 29:Issue 4(2017) Page Start: 173 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Discrete phase method study of ball grid array underfill process using nano-silica filler-reinforced composite-encapsulant with varying filler loadings. (May 2017) Authors: Ng, Fei Chong; Abas, Aizat; Gan, Z.L.; Abdullah, M.Z.; Che Ani, F.; Yusuf Tura Ali, M. Journal: Microelectronics and reliability Issue: Volume 72(2017) Page Start: 45 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Effect of different temperature distribution on multi-stack BGA package. Issue 2 (26th February 2021) Authors: Tung, Lun Hao; Ng, Fei Chong; Abas, Aizat; Abdullah, M.Z.; Samsudin, Zambri; Tura Ali, Mohd Yusuf Journal: Microelectronics international Issue: Volume 38:Issue 2(2021) Page Start: 33 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Effect of solder bump shapes on underfill flow in flip-chip encapsulation using analytical, numerical and PIV experimental approaches. (February 2018) Authors: Ng, Fei Chong; Abas, Aizat; Abdullah, M.Z. Journal: Microelectronics and reliability Issue: Volume 81(2018) Page Start: 41 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Effect of thermocapillary action in the underfill encapsulation of multi-stack ball grid array. (November 2016) Authors: Ng, Fei Chong; Abas, Aizat; Ishak, MHH; Abdullah, MZ; Aziz, Abdul Journal: Microelectronics and reliability Issue: Volume 66(2016) Page Start: 143 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Failure analysis of various fiberglass cross-arm designs under multi-axial loading. Issue 1 (September 2020) Authors: Mohamad, Daud; Beddu, Salmia; Syamsir, Agusril; Zahari, Nazirul Mubin; Razali, Muhammad Fauzinizam; Abu Seman, Sareh Aiman Hilmi; Abas, Aizat; Ng, Fei Chong Journal: IOP conference series Issue: Volume 920:Issue 1(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Filling efficiency of flip-chip underfill encapsulation process. Issue 1 (11th October 2019) Authors: Ng, Fei Chong; Abas, Mohamad Aizat; Abdullah, Mohd Zulkifly Journal: Soldering & surface mount technology Issue: Volume 32:Issue 1(2020) Page Start: 10 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Filling efficiency of flip-chip underfill encapsulation process. Issue 1 (3rd February 2020) Authors: Ng, Fei Chong; Abas, Mohamad Aizat; Abdullah, Mohd Zulkifly Journal: Soldering & surface mount technology Issue: Volume 32:Issue 1(2020) Page Start: 10 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Performance Evaluation of Composite Cross-Arm Structure Under Different Magnitude of Loading. Issue 1 (September 2020) Authors: Mohamad, Daud; Beddu, Salmia; Syamsir, Agusril; Zahari, Nazirul Mubin; Abu Seman, Sareh Aiman Hilmi; Razali, Muhammad Fauzinizam; Abas, Aizat; Ng, Fei Chong Journal: IOP conference series Issue: Volume 920:Issue 1(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗