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1. Au–Cu Alloys Prepared by Pulse Electrodeposition toward Applications as Movable Micro-Components in Electronic Devices. Issue 2 (11th January 2018)

2. Au–Cu Alloys Prepared by Pulse Electrodeposition toward Applications as Movable Micro-Components in Electronic Devices. Issue 2 (1st January 2018)

3. High Strength Electrodeposited Au-Cu Alloys Evaluated by Bending Test toward Movable Micro-Components. (1st January 2019)

4. High Strength Electrodeposited Au-Cu Alloys Evaluated by Bending Test toward Movable Micro-Components. (23rd July 2019)