1. Adhesion Energy and Bonding Wave Velocity Measurements. (24th August 2016) Authors: Larrey, Vincent; Mauguen, Gaelle; Fournel, Frank; Radisson, Damien; Rieutord, François; Morales, Christophe; Bridoux, Claudine; Moriceau, Hubert Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 145 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Edge Water Penetration in Direct Bonding Interface. (24th August 2016) Authors: Rieutord, François; Tardif, Samuel; Landru, Didier; Kononchuk, Oleg; Larrey, Vincent; Moriceau, Hubert; Tedjini, Marwan; Fournel, Frank Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 163 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Electrical modeling of the GaAs/InP wafer bonded heterojunction. Issue 2 (23rd January 2014) Authors: Blot, Xavier; Scheiblin, Pascal; Moriceau, Hubert; Daele, William Van Den; Lecouvey, Christophe; Delprat, Daniel; Tauzin, Aurélie; Drazek, Charlotte; Guiot, Eric Journal: Physica status solidi Issue: Volume 11:Issue 2(2014:Feb.) Page Start: 222 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Impact of Water Edge Absorption on Silicon Oxide Direct Bonding Energy. (24th August 2016) Authors: Fournel, Frank; Tedjini, Marwan; Larrey, Vincent; Rieutord, François; Morales, Christophe; Bridoux, Claudine; Moriceau, Hubert Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 129 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. SiO2-SiO2 die-to-wafer direct bonding interface weakening. (April 2020) Authors: Tabata, Toshiyuki; Sanchez, Loic; Larrey, Vincent; Fournel, Frank; Moriceau, Hubert Journal: Microelectronics and reliability Issue: Volume 107(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Study of high-temperature Smart Cut™: Application to silicon-on-sapphire films and to thin foils of single crystal silicon. (January 2016) Authors: Meyer, Raphaël; Kononchuck, Oleg; Moriceau, Hubert; Lemiti, Mustapha; Bruel, Michel Journal: Solid-state electronics Issue: Volume 115 Part B(2016) Page Start: 225 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Thin Layer Transfer Using Room Temperature Wafer-Level Bonding Process. (24th August 2016) Authors: Abadie, Karine; Fournel, Frank; Morales, Christophe; Moriceau, Hubert; Wimplinger, Markus Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 203 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗