Edge Water Penetration in Direct Bonding Interface. (24th August 2016)

• Record Type: Journal Article
• Authors: Rieutord, François; Tardif, Samuel; Landru, Didier; Kononchuk, Oleg; Larrey, Vincent; Moriceau, Hubert; Tedjini, Marwan; Fournel, Frank
• Is Part Of: ECS transactions. Volume 75:Number 9(2016)
• Page Start: 163
• Page End: 167
• Publication Date: 2016-08-24
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/07509.0163ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : We report here on measurements demonstrating that water is able to enter a hydrophilic wafer bonding assembly from the edge. The driving forces for water entry are capillary forces driven by the negative Laplace pressure. The characteristic time for water to penetrate the interface is consistent with standard values for water viscosity and gap width.