Author/Creator: Mazullah, - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Mazullah,

1. Structural and mechanical analyses of soldering materials containing Pb, Sn, Ag, Cu, Bi and Zn. (2021)

Authors:: Mazullah, ; Khan, Maaz; Ali, Ghafar; Khan, Muhammad Naeem; Zaib, Aurang; Abbas, Shafqat
Journal:: Materials today
Issue:: Volume 47:Suppement(2021)
Page Start:: S83
Record Type:: Journal Article
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2. Thermal aging impact on microstructure, creep and corrosion behavior of lead-free solder alloy (SAC387) use in electronics. (July 2021)

Authors:: Mazullah, ; Sadiq, Muhammad; Khan, Maaz; Mateen, Abdul; Shahzad, Muhammad; Akhtar, Kareem; Khan, Jawad
Journal:: Microelectronics and reliability
Issue:: Volume 122(2021)
Page Start:
Record Type:: Journal Article
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