Structural and mechanical analyses of soldering materials containing Pb, Sn, Ag, Cu, Bi and Zn. (2021)

• Record Type: Journal Article
• Authors: Mazullah, ; Khan, Maaz; Ali, Ghafar; Khan, Muhammad Naeem; Zaib, Aurang; Abbas, Shafqat
• Is Part Of: Materials today. Volume 47:Suppement(2021)
• Page Start: S83
• Page End: S93
• Publication Date: 2021
• Subjects: Microstructural -- Shear Stress -- Deformation -- Shear Strain -- Soldering Materials; Materials science -- Congresses -- Periodicals; 620.1
• DOI: 10.1016/j.matpr.2020.05.501
• Languages: English
• ISSNs: 2214-7853

Abstract

Abstract: In present work the microstructural and mechanical properties (such as shear stress, shear strain, deformation and creep behaviour) of solder joints of four different solders at temperatures of 100 °C and 150 °C was studied. The soldering materials included in this study were: Type A—Sn-36.00Pb-2.00Ag, Type B—Sn-3.80Ag-0.70Cu, Type C—Sn-3.30Ag-3.82Bi and Type D—Sn-8.00Zn-3.00Bi. Microstructure and mechanical properties of solders were studied by using Scanning Electron Microscopy (SEM), Energy Dispersive Spectroscopy (EDS) and Universal Testing Machine. It has been observed that the mechanical properties of Type B are not significantly changed with increase in temperature as compared to other materials.