1. Following crack path selection in multifilm structures with weak and strong interfaces by in situ 4-point-bending. Issue 8 (13th April 2015) Authors: Völker, Bernhard; Venkatesan, Sriram; Heinz, Walther; Matoy, Kurt; Roth, Roman; Batke, Jörg-Martin; Cordill, Megan J.; Dehm, Gerhard Journal: Journal of materials research Issue: Volume 30:Issue 8(2015) Page Start: 1090 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics. (October 2016) Authors: Philippi, Bastian; Matoy, Kurt; Zechner, Johannes; Kirchlechner, Christoph; Dehm, Gerhard Journal: Scripta materialia Issue: Volume 123(2016) Page Start: 38 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. On the influence of microcantilever pre-crack geometries on the apparent fracture toughness of brittle materials. (1st September 2017) Authors: Brinckmann, Steffen; Matoy, Kurt; Kirchlechner, Christoph; Dehm, Gerhard Journal: Acta materialia Issue: Volume 136(2017) Page Start: 281 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗