Fracture toughness of intermetallic Cu6Sn5 in lead-free solder microelectronics. (October 2016)

• Record Type: Journal Article
• Authors: Philippi, Bastian; Matoy, Kurt; Zechner, Johannes; Kirchlechner, Christoph; Dehm, Gerhard
• Is Part Of: Scripta materialia. Volume 123(2016)
• Page Start: 38
• Page End: 41
• Publication Date: 2016-10
• Subjects: Lead-free solder -- Cu6Sn5 -- Small-scale testing -- Fracture toughness; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2016.05.039
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: Even though lead-free Sn-Ag-Cu based solder alloys are emerging as promising candidates to replace well-established but hazardous lead-containing solders, they suffer from limited knowledge about their mechanical performance. To ensure the high reliability demands in microelectronics, fracture properties need to be quantified with respect to crucial microstructural elements like Cu6 Sn5 intermetallic compounds formed at common Cu metallization interfaces. While indentation fracture testing methods have shown varying fracture toughness values, micro-cantilever fracture testing is applied in this work on FIB-prepared single-crystalline Cu6 Sn5 cantilevers to clarify on the microstructure-fracture relationship. Graphical abstract: