Author/Creator: Kuno, A. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Kuno, A.

1. Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. (September 2016)

Authors:: Ishizaki, T.; Miura, D.; Kuno, A.; Nagao, R.; Aoki, S.; Ohshima, Y.; Kino, T.; Usui, M.; Yamada, Y.
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 287
Record Type:: Journal Article
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2. Power cycle reliability of Cu nanoparticle joints with mismatched coefficients of thermal expansion. (September 2016)

Authors:: Ishizaki, T.; Miura, D.; Kuno, A.; Nagao, R.; Aoki, S.; Ohshima, Y.; Kino, T.; Usui, M.; Yamada, Y.
Journal:: Microelectronics and reliability
Issue:: Volume 64(2016)
Page Start:: 287
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. Thermal simulation of joints with high thermal conductivities for power electronic devices. Issue 7 (June 2015)

Authors:: Ishizaki, T.; Yanase, M.; Kuno, A.; Satoh, T.; Usui, M.; Osawa, F.; Yamada, Y.
Journal:: Microelectronics and reliability
Issue:: Volume 55:Issue 7(2015)
Page Start:: 1060
Record Type:: Journal Article
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4. Young's modulus of a sintered Cu joint and its influence on thermal stress. (September 2017)

Authors:: Ishizaki, T.; Miura, D.; Kuno, A.; Hasegawa, K.; Usui, M.; Yamada, Y.
Journal:: Microelectronics and reliability
Issue:: Volume 76/77(2017)
Page Start:: 405
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗