1. Demonstration of 90 000 superconductive bump connections for massive quantum computing. (15th March 2023) Authors: Araga, Yuuki; Nakagawa, Hiroshi; Hashino, Masaru; Kikuchi, Katsuya Journal: Japanese journal of applied physics Issue: Volume 62:Number SC(2023) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Evaluation of substrate noise suppression method to mitigate crosstalk among trough-silicon vias. (16th March 2018) Authors: Araga, Yuuki; Kikuchi, Katsuya; Aoyagi, Masahiro Journal: Japanese journal of applied physics Issue: Volume 57:Number 4(2018)Supplement Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Fabrication and stacking of through-silicon-via array chip formed by notchless Si etching and wet cleaning of first metal layer. (23rd May 2019) Authors: Watanabe, Naoya; Kikuchi, Hidekazu; Yanagisawa, Azusa; Shimamoto, Haruo; Kikuchi, Katsuya; Aoyagi, Masahiro; Nakamura, Akio Journal: Japanese journal of applied physics Issue: Volume 58:Number SD(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Fabrication and stress analysis of annular-trench-isolated TSV. (August 2016) Authors: Feng, Wei; Bui, Tung Thanh; Watanabe, Naoya; Shimamoto, Haruo; Aoyagi, Masahiro; Kikuchi, Katsuya Journal: Microelectronics and reliability Issue: Volume 63(2016) Page Start: 142 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Fabrication and stress analysis of annular-trench-isolated TSV. (August 2016) Authors: Feng, Wei; Bui, Tung Thanh; Watanabe, Naoya; Shimamoto, Haruo; Aoyagi, Masahiro; Kikuchi, Katsuya Journal: Microelectronics and reliability Issue: Volume 63(2016) Page Start: 142 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Fluidic platform with embedded differential capacitively coupled contactless conductivity detector for micro-object sensing. (2018) Authors: Do, Loc Quang; Bui, Tung Thanh; Tran, Ha Thuy Thi; Kikuchi, Katsuya; Aoyagi, Masahiro; Duc, Trinh Chu Journal: International journal of nanotechnology Issue: Volume 15:Number 1/2/3(2018) Page Start: 24 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Fully epitaxial giant magnetoresistive devices with half-metallic Heusler alloy fabricated on poly-crystalline electrode using three-dimensional integration technology. (November 2020) Authors: Chen, Jiamin; Sakuraba, Yuya; Yakushiji, Kay; Kurashima, Yuichi; Watanabe, Naoya; Liu, Jun; Li, Songtian; Fukushima, Akio; Takagi, Hideki; Kikuchi, Katsuya; Yuasa, Shinji; Hono, Kazuhiro Journal: Acta materialia Issue: Volume 200(2020) Page Start: 1038 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Impact of die thinning on the thermal performance of a central TSV bus in a 3D stacked circuit. Issue 12 (December 2015) Authors: Melamed, Samson; Imura, Fumito; Nakagawa, Hiroshi; Kikuchi, Katsuya; Hagimoto, Michiya; Matsumoto, Yukoh; Aoyagi, Masahiro Journal: Microelectronics journal Issue: Volume 46:Issue 12 Part A (2015) Page Start: 1106 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Impact of thinning stacked dies on the thermal resistance of bump-bonded three-dimensional integrated circuits. (December 2016) Authors: Melamed, Samson; Watanabe, Naoya; Nemoto, Shunsuke; Shimamoto, Haruo; Kikuchi, Katsuya; Aoyagi, Masahiro Journal: Microelectronics and reliability Issue: Volume 67(2016) Page Start: 2 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Interfacial Analysis of Plasma Fusion Bonded Interfaces Under Various Bonding Conditions by Neutron Reflectometry. (8th September 2020) Authors: Fujino, Masahisa; Takahashi, Kenji; Kikuchi, Katsuya; Miyata, Noboru; Yoshida, Tessei; Miyazaki, Tsukasa Journal: ECS transactions Issue: Volume 98:Number 4(2020) Page Start: 11 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗