1. Reliability of pressure-free Cu nanoparticle joints for power electronic devices. (September 2019) Authors: Yamada, Y.; Hasegawa, K.; Ikeda, Y.; Kasagi, Y.; Katagiri, K.; Katou, H.; Watanabe, H.; Takenaka, A.; Nagata, H.; Sekine, N.; Sano, Y. Journal: Microelectronics and reliability Issue: Volume 100/101(2019) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗