1. A comparative study of lapping and grinding induced surface/subsurface damage of silicon wafers and corresponding polishing efficiency. (18th September 2020) Authors: Li, Zhiyuan; Gao, Shang; Kang, Renke; Li, Honggang; Guo, Xiaoguang Journal: International journal of abrasive technology Issue: Volume 10:Number 2(2020) Page Start: 122 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A fast self-calibration method of line laser sensors for on-machine measurement of honeycomb cores. (May 2022) Authors: Qin, Yan; Kang, Renke; Sun, Jiansong; Wang, Yidan; Zhu, Xianglong; Dong, Zhigang Journal: Optics and lasers in engineering Issue: Volume 152(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. A form error evaluation method of honeycomb core surface. (30th September 2022) Authors: Qin, Yan; Kang, Renke; Wang, Yidan; Sun, Jiansong; Dong, Zhigang Journal: Measurement Issue: Volume 201(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. A load identification method for the grinding damage induced stress (GDIS) distribution in silicon wafers. (August 2016) Authors: Zhou, Ping; Xu, Shance; Wang, Ziguang; Yan, Ying; Kang, Renke; Guo, Dongming Journal: International journal of machine tools & manufacture Issue: Volume 107(2016:Aug.) Page Start: 1 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. A new method for measuring the flatness of large and thin silicon substrates using a liquid immersion technique. (9th October 2015) Authors: Liu, Haijun; Dong, Zhigang; Huang, Han; Kang, Renke; Zhou, Ping Journal: Measurement science & technology Issue: Volume 26:Number 11(2015:Nov.) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. A novel reverse helical milling process for reducing push-out delamination of CFRP. (1st December 2020) Authors: Yang, Guolin; Dong, Zhigang; Gao, Shang; Bao, Yan; Kang, Renke; Guo, Dongming Journal: Composite structures Issue: Volume 253(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. A theoretical and experimental investigation on ultrasonic assisted grinding from the single-grain aspect. (November 2018) Authors: Zheng, Feifei; Kang, Renke; Dong, Zhigang; Guo, Jiang; Liu, Jinting; Zhang, Jiatong Journal: International journal of mechanical sciences Issue: Volume 148(2018) Page Start: 667 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Al2O3-ZrO2 eutectic ceramic via ultrasonic-assisted laser engineered net shaping. Issue 17 (1st December 2017) Authors: Yan, Shuai; Wu, Dongjiang; Niu, Fangyong; Ma, Guangyi; Kang, Renke Journal: Ceramics international Issue: Volume 43:Issue 17(2017) Page Start: 15905 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. An empirical equation for prediction of silicon wafer deformation. (14th June 2017) Authors: Zhu, Xianglong; Chen, Xiuyi; Liu, Haijun; Kang, Renke; Zhang, Bi; Dong, Zhigang Journal: Materials research express Issue: Volume 4:Number 6(2017) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Atomistic understanding of the subsurface damage mechanism of silicon (100) during the secondary nano-scratching processing. (15th June 2022) Authors: Yuan, Song; Guo, Xiaoguang; Liu, Shengtong; Li, Penghui; Liu, Fumin; Zhang, Lemin; Kang, Renke Journal: Materials science in semiconductor processing Issue: Volume 144(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗