1. Investigation of electrical characteristics of flexible CMOS devices fabricated with thickness-controlled spalling process. (November 2020) Authors: Park, Honghwi; Lim, Changhee; Noh, Yeho; Lee, Chang-Ju; Won, Heungsup; Jung, Jaedong; Choi, Muhan; Kim, Jae-Joon; Yoo, Hocheon; Park, Hongsik Journal: Solid-state electronics Issue: Volume 173(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗