1. Communication—Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass. Issue 1 (1st January 2019) Authors: Chang, Yiu-Hsiang; Tseng, Pei-Lien; Lin, Jen-Chieh; Chen, Jie-Chi; Huang, Meng-Chi; Lin, Hung-Yi; Pollard, Scott; Mazumder, Prantik Journal: Journal of the Electrochemical Society Issue: Volume 166:Issue 1(2019) Page Start: D3155 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Communication—Defect-Free Filling of High Aspect Ratio Through Vias in Ultrathin Glass. Issue 1 (27th November 2018) Authors: Chang, Yiu-Hsiang; Tseng, Pei-Lien; Lin, Jen-Chieh; Chen, Jie-Chi; Huang, Meng-Chi; Lin, Hung-Yi; Pollard, Scott; Mazumder, Prantik Journal: Journal of the Electrochemical Society Issue: Volume 166:Issue 1(2019) Page Start: D3155 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗