1. Effect of pulse-reverse plating on copper: Thermal mechanical properties and microstructure relationship. (May 2019) Authors: Huang, Bau-Chin; Yang, Cheng-Hsien; Lee, Cheng-Yu; Hu, Yu-Lung; Hsu, Chi-Chang; Ho, Cheng-En Journal: Microelectronics and reliability Issue: Volume 96(2019) Page Start: 71 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. High-speed electrodeposition for Cu pillar fabrication and Cu pillar adhesion to an Ajinomoto build-up film (ABF). (August 2021) Authors: Lee, Pei-Tzu; Chang, Chih-Hao; Lee, Cheng-Yu; Wu, Ying-Syuan; Yang, Cheng-Hsien; Ho, Cheng-En Journal: Materials & design Issue: Volume 206(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu. (1st January 2019) Authors: Yang, Cheng-Hsien; Lee, Cheng-Yu; Huang, Bau-Chin; Lin, Ping-Chou; Ho, Cheng-En Journal: ECS journal of solid state science and technology Issue: Volume 8:Number 6(6019) Page Start: P363 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Nanoindentation Study of Single-Crystalline and (101)-Oriented Nanotwinned Cu. (25th June 2019) Authors: Yang, Cheng-Hsien; Lee, Cheng-Yu; Huang, Bau-Chin; Lin, Ping-Chou; Ho, Cheng-En Journal: ECS journal of solid state science and technology Issue: Volume 8:Number 6(6019) Page Start: P363 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Real-time X-ray microscopy study of electromigration in microelectronic solder joints. (15th March 2016) Authors: Ho, Cheng-En; Yang, Cheng-Hsien; Lee, Pei-Tzu; Chen, Chih-Tsung Journal: Scripta materialia Issue: Volume 114(2016) Page Start: 79 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures. Issue 13 (10th September 2019) Authors: Yang, Cheng-Hsien; Lee, Yu-Wei; Lee, Cheng-Yu; Chang, Chih-Hao; Ho, Cheng-En Journal: Journal of the Electrochemical Society Issue: Volume 166:Issue 13(2019) Page Start: D683 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Self-Annealing Behavior of Electroplated Cu in Blind-Hole Structures. Issue 13 (1st January 2019) Authors: Yang, Cheng-Hsien; Lee, Yu-Wei; Lee, Cheng-Yu; Chang, Chih-Hao; Ho, Cheng-En Journal: Journal of the Electrochemical Society Issue: Volume 166:Issue 13(2019) Page Start: D683 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Self-Annealing Behavior of Electroplated Cu with Different Brightener Concentrations. Issue 8 (20th May 2020) Authors: Yang, Cheng-Hsien; Lee, Yu-Wei; Lee, Cheng-Yu; Lee, Pei-Tzu; Ho, Cheng-En Journal: Journal of the Electrochemical Society Issue: Volume 167:Issue 8(2020) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Synchrotron X-ray study of electromigration, whisker growth, and residual strain evolution in a Sn Blech structure. (June 2022) Authors: Lee, Pei-Tzu; Hsieh, Wan-Zhen; Lee, Cheng-Yu; Tseng, Shao-Chin; Tang, Mau-Tsu; Chiang, Ching-Yu; Kao, C.R.; Ho, Cheng-En Journal: Scripta materialia Issue: Number 214(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗