Real-time X-ray microscopy study of electromigration in microelectronic solder joints. (15th March 2016)

• Record Type: Journal Article
• Authors: Ho, Cheng-En; Yang, Cheng-Hsien; Lee, Pei-Tzu; Chen, Chih-Tsung
• Is Part Of: Scripta materialia. Volume 114(2016)
• Page Start: 79
• Page End: 83
• Publication Date: 2016-03-15
• Subjects: Transmission X-ray microscopy -- 3D μ-CT -- Solder joints -- Electromigration -- Abnormal Cu depletion; Materials -- Periodicals; Metallurgy -- Periodicals; Metalen; Legeringen; Materiaalkunde; Metals, metalworking and machinery industries; Metals; Electronic journals; 620.11
• DOI: 10.1016/j.scriptamat.2015.12.001
• Languages: English
• ISSNs: 1359-6462

Abstract

Abstract: Electromigration (EM) in microelectronic solder joints was investigated via transmission X-ray microscopy (TXM) in conjunction with three-dimensional computed microtomography (3D μ-CT). This nondestructive analysis provided visualization of the EM dynamics in the encapsulated solder joints and showed the linear dependence of the Cu pad depletion on the current stressing time. Quantitative analysis of the interstitial Cu diffusion in β-Sn based on Huntington's EM theory offered rationalization of this EM-induced degradation mechanism. Graphical abstract: