Author/Creator: Geczy, Attila - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Geczy, Attila

1. Advances in pressure sensing for vapour phase soldering process monitoring. Issue 3 (31st May 2019)

Authors:: Alaya, Mohamed Amine; Geczy, Attila; Illes, Balazs; Harsányi, Gábor; Bušek, David
Journal:: Soldering & surface mount technology
Issue:: Volume 31:Issue 3(2019)
Page Start:: 169
Record Type:: Journal Article
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2. Effect of different thermocouple constructions on heat-level vapour phase soldering profiles. Issue 4 (31st March 2020)

Authors:: Alaya, Mohamed Amine; Megyeri, Viktória; Bušek, David; Harsányi, Gábor; Geczy, Attila
Journal:: Soldering & surface mount technology
Issue:: Volume 32:Issue 4(2020)
Page Start:: 253
Record Type:: Journal Article
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3. Effects of high current density on lead-free solder joints of chip-size passive SMD components. Issue 2 (19th February 2018)

Authors:: Geczy, Attila; Straubinger, Daniel; Kovacs, Andras; Krammer, Oliver; Mach, Pavel; Harsányi, Gábor
Journal:: Soldering & surface mount technology
Issue:: Volume 30:Issue 2(2018)
Page Start:: 74
Record Type:: Journal Article
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4. Effects of high current density on lead-free solder joints of chip-size passive SMD components. Issue 2 (3rd April 2018)

Authors:: Geczy, Attila; Straubinger, Daniel; Kovacs, Andras; Krammer, Oliver; Mach, Pavel; Harsányi, Gábor
Journal:: Soldering & surface mount technology
Issue:: Volume 30:Issue 2(2018)
Page Start:: 74
Record Type:: Journal Article
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5. Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces. Issue 4 (8th April 2020)

Authors:: Straubinger, Daniel; Bozsóki, István; Illes, Balazs; Krammer, Oliver; Bušek, David; Geczy, Attila
Journal:: Soldering & surface mount technology
Issue:: Volume 32:Issue 4(2020)
Page Start:: 247
Record Type:: Journal Article
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6. Heat transfer aspects of condensation during vapour phase soldering on aligned PCB-based surfaces. Issue 4 (9th April 2020)

Authors:: Straubinger, Daniel; Bozsóki, István; Illes, Balazs; Krammer, Oliver; Bušek, David; Geczy, Attila
Journal:: Soldering & surface mount technology
Issue:: Volume 32:Issue 4(2020)
Page Start:: 247
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

7. Investigating and compensating printed circuit board shrinkage induced failures during reflow soldering. Issue 2 (7th April 2015)

Authors:: Geczy, Attila; Fejos, Márta; Tersztyánszky, László
Journal:: Soldering & surface mount technology
Issue:: Volume 27:Issue 2(2015)
Page Start:: 61
Record Type:: Journal Article
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8. Reflow soldering : apparatus and heat transfer processes /: apparatus and heat transfer processes. (2020)

Authors:: Balazs, Habil Illes; Krammer, Olivér; Geczy, Attila
Record Type:: Book
Extent:: 1 online resource, illustrations (black and white, and colour)
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9. Studying heat transfer on inclined printed circuit boards during vapour phase soldering. Issue 1 (6th February 2017)

Authors:: Geczy, Attila; Nagy, Daniel; Illes, Balazs; Fazekas, Laszlo; Krammer, Oliver; Busek, David
Journal:: Soldering & surface mount technology
Issue:: Volume 29:Issue 1(2017)
Page Start:: 34
Record Type:: Journal Article
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