Author/Creator: Ge, Peiqi - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Ge, Peiqi

1. A new method of determining the slicing parameters for fixed diamond wire saw. (December 2020)

Authors:: Liu, Tengyun; Ge, Peiqi; Bi, Wenbo; Gao, Yufei
Journal:: Materials science in semiconductor processing
Issue:: Volume 120(2020)
Page Start:
Record Type:: Journal Article
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2. A scratching force model of diamond abrasive particles in wire sawing of single crystal SiC. (September 2017)

Authors:: Wang, Peizhi; Ge, Peiqi; Li, Zongqiang; Ge, Mengran; Gao, Yufei
Journal:: Materials science in semiconductor processing
Issue:: Volume 68(2017)
Page Start:: 21
Record Type:: Journal Article
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3. Action mechanism of liquid bridge between electroplated diamond wires for ultrathin wafer slicing. (1st January 2022)

Authors:: Zheng, Jintao; Ge, Peiqi; Bi, Wenbo; Zhao, Yukang; Wang, Chao
Journal:: Solar energy
Issue:: Volume 231(2022)
Page Start:: 343
Record Type:: Journal Article
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4. An on-line inspection method for abrasive distribution uniformity of electroplated diamond wire saw. (November 2021)

Authors:: Zhao, Yukang; Bi, Wenbo; Ge, Peiqi
Journal:: Journal of manufacturing processes
Issue:: Volume 71(2021)
Page Start:: 290
Record Type:: Journal Article
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5. Analysis of Antireflection Performance of V‐Ring Groove Structures for Photovoltaic Crystal Silicon Solar Cells. Issue 5 (9th January 2020)

Authors:: Yao, Longxu; Zhang, Lei; Ge, Peiqi; Gao, Yufei; Wang, Hui
Journal:: Physica status solidi
Issue:: Volume 217:Issue 5(2020)
Page Start:: n/a
Record Type:: Journal Article
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6. Analytical modeling of the stress field in scratching anisotropic single-crystal silicon. (December 2022)

Authors:: Li, Long; Ge, Peiqi
Journal:: Materials science in semiconductor processing
Issue:: Volume 152(2023)
Page Start:
Record Type:: Journal Article
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7. Crack damage control for diamond wire sawing of silicon: The selection of processing parameters. (September 2022)

Authors:: Ge, Mengran; Chen, Zibin; Wang, Peizhi; Ge, Peiqi
Journal:: Materials science in semiconductor processing
Issue:: Volume 148(2022)
Page Start:
Record Type:: Journal Article
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8. Depth of cut for single abrasive and cutting force in resin bonded diamond wire sawing. Issue 5 (February 2017)

Authors:: Liu, Tengyun; Ge, Peiqi; Gao, Yufei; Bi, Wenbo
Journal:: International journal of advanced manufacturing technology
Issue:: Volume 88:Issue 5/8(2017)
Page Start:: 1763
Record Type:: Journal Article
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9. Effect of capillary adhesion on fracture of photovoltaic silicon wafers during diamond wire slicing. (15th May 2022)

Authors:: Zheng, Jintao; Ge, Peiqi; Bi, Wenbo; Zhao, Yukang; Wang, Chao
Journal:: Solar energy
Issue:: Volume 238(2022)
Page Start:: 105
Record Type:: Journal Article
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10. Effect of wire speed on subsurface cracks in wire sawing process of single crystal silicon carbide. (15th October 2017)

Authors:: Wang, Peizhi; Ge, Peiqi; Bi, Wenbo; Ge, Mengran; Liu, Tengyun
Journal:: Engineering fracture mechanics
Issue:: Volume 184(2017)
Page Start:: 273
Record Type:: Journal Article
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