1. Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs. Issue 1 (25th February 2019) Authors: Straubinger, Dániel; Géczy, Attila; Sipos, András; Kiss, András; Gyarmati, Dániel; Krammer, Oliver; Rigler, Dániel; Bušek, David; Harsányi, Gábor Journal: Circuit world Issue: Volume 45:Issue 1(2019) Page Start: 37 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Advances on high current load effects on lead-free solder joints of SMD chip-size components and BGAs. Issue 1 (4th February 2019) Authors: Straubinger, Dániel; Géczy, Attila; Sipos, András; Kiss, András; Gyarmati, Dániel; Krammer, Oliver; Rigler, Dániel; Bušek, David; Harsányi, Gábor Journal: Circuit world Issue: Volume 45:Issue 1(2019) Page Start: 37 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes. Issue 1 (1st February 2016) Authors: Illés, Balázs; Krammer, Olivér; Géczy, Attila; Garami, Tamás Journal: Soldering & surface mount technology Issue: Volume 28:Issue 1(2016) Page Start: 2 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Characterizing the conductivity of ICA joints by the mean intercept length of Ag flakes. Issue 1 (1st February 2016) Authors: Illés, Balázs; Krammer, Olivér; Géczy, Attila; Garami, Tamás Editors: Agata Skwarek, Dr Journal: Soldering & surface mount technology Issue: Volume 28:Issue 1(2016) Page Start: 2 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Compact numerical modelling of transient condensate layer formation on small components during vapour phase soldering. (June 2022) Authors: Bozsóki, István; Illés, Balázs; Géczy, Attila Journal: International communications in heat and mass transfer Issue: Volume 135(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Comparative study on proper thermocouple attachment for vapour phase soldering profiling. Issue 1 (1st February 2016) Authors: Géczy, Attila; Kvanduk, Bíborka; Illes, Balazs; Harsányi, Gábor Journal: Soldering & surface mount technology Issue: Volume 28:Issue 1(2016) Page Start: 7 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Comparative study on proper thermocouple attachment for vapour phase soldering profiling. Issue 1 (1st February 2016) Authors: Géczy, Attila; Kvanduk, Bíborka; Illes, Balazs; Harsányi, Gábor Editors: Agata Skwarek, Dr Journal: Soldering & surface mount technology Issue: Volume 28:Issue 1(2016) Page Start: 7 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Component level modelling of heat transfer during vapour phase soldering with finite difference ADI approach. (January 2019) Authors: Bozsóki, István; Géczy, Attila; Illés, Balázs Journal: International journal of heat and mass transfer Issue: Volume 128(2019) Page Start: 562 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Corrosion-induced tin whisker growth in electronic devices: a review. Issue 1 (6th February 2017) Authors: Illés, Balázs; Horváth, Barbara; Géczy, Attila; Krammer, Olivér; Dušek, Karel Journal: Soldering & surface mount technology Issue: Volume 29:Issue 1(2017) Page Start: 59 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Determination of soil density by cone index data. (June 2018) Authors: Pillinger, György; Géczy, Attila; Hudoba, Zoltán; Kiss, Péter Journal: Journal of terramechanics Issue: Volume 77(2018) Page Start: 69 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗