Author/Creator: Fine, Morris E. - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Fine, Morris E.

1. A continuum damage mechanics-based unified creep and plasticity model for solder materials. (15th January 2015)

Authors:: Yao, Yao; He, Xu; Keer, Leon M.; Fine, Morris E.
Journal:: Acta materialia
Issue:: Volume 83(2015)
Page Start:: 160
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

2. A continuum damage mechanics-based unified creep and plasticity model for solder materials. (15th January 2015)

Authors:: Yao, Yao; He, Xu; Keer, Leon M.; Fine, Morris E.
Journal:: Acta materialia
Issue:: Volume 83(2015)
Page Start:: 160
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

3. An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect. (15th January 2015)

Authors:: Yao, Yao; Wang, Yuexing; Keer, Leon M.; Fine, Morris E.
Journal:: Scripta materialia
Issue:: Volume 95(2015)
Page Start:: 7
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

4. An analytical method to predict electromigration-induced finger-shaped void growth in SnAgCu solder interconnect. (15th January 2015)

Authors:: Yao, Yao; Wang, Yuexing; Keer, Leon M.; Fine, Morris E.
Journal:: Scripta materialia
Issue:: Volume 95(2015)
Page Start:: 7
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗

5. Characteristics of stress relaxation kinetics of La60Ni15Al25 bulk metallic glass. (1st October 2015)

Authors:: Qiao, J.C.; Wang, Yun-Jiang; Pelletier, J.M.; Keer, Leon M.; Fine, Morris E.; Yao, Y.
Journal:: Acta materialia
Issue:: Volume 98(2015)
Page Start:: 43
Record Type:: Journal Article
View Content:: Available online (eLD content is only available in our Reading Rooms) ↗