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3. FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration. (November 2015)

4. Improvement of performances HfO2-based RRAM from elementary cell to 16 kb demonstrator by introduction of thin layer of Al2O3. (November 2016)

5. Improvement of performances HfO2-based RRAM from elementary cell to 16 kb demonstrator by introduction of thin layer of Al2O3. (November 2016)