1. A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging. Issue 6 (17th July 2020) Authors: Huber, Fabian; Etschmaier, Harald; Walter, Hans; Urstöger, Georg; Hadley, Peter Journal: International journal of polymer analysis and characterization Issue: Volume 25:Issue 6(2020) Page Start: 467 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging. Issue 6 (17th July 2020) Authors: Huber, Fabian; Etschmaier, Harald; Walter, Hans; Urstöger, Georg; Hadley, Peter Journal: International journal of polymer analysis and characterization Issue: Volume 25:Issue 6(2020) Page Start: 467 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗