A time–temperature–moisture concentration superposition principle that describes the relaxation behavior of epoxide molding compounds for microelectronics packaging. Issue 6 (17th July 2020)

• Record Type: Journal Article
• Authors: Huber, Fabian; Etschmaier, Harald; Walter, Hans; Urstöger, Georg; Hadley, Peter
• Is Part Of: International journal of polymer analysis and characterization. Volume 25:Issue 6(2020)
• Page Start: 467
• Page End: 478
• Publication Date: 2020-07-17
• Subjects: Plasticization -- viscoelasticity -- moisture -- time–temperature–moisture concentration superposition -- packaging; Polymers -- Analysis -- Periodicals; 547.705
• DOI: 10.1080/1023666X.2020.1807680
• Languages: English
• ISSNs: 1023-666X

Abstract

Abstract: Time–temperature superposition is a well-established principle used in the constitutive description of viscoelastic polymers. To expand the description to moisture-induced plasticization effects, two epoxide-based molding compounds used in microelectronics packaging were characterized by dynamic mechanical analysis under varying temperature and moisture controlled environments in their glassy regime. Conditions of up to 85 °C and 85% relative humidity, relevant for industry-defined reliability standards, were applied. By relating the transient ambient conditions to the actual moisture concentration of the samples, temperature-, and moisture concentration-dependent relaxation functions were obtained. By applying a time–temperature–moisture concentration superposition, it is shown, that the materials' behavior can be described assuming a linear dependence of the relative free volume on both temperature and concentration. The two parameters can be super-positioned in the description of the shift of the relaxation time constant spectrum with negligible cross-correlation for the conditions of industrial interest.