1. (Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration. (20th July 2018) Authors: Plach, Thomas; Rebhan, Bernhard; Dragoi, Viorel; Wagenleitner, Thomas; Wimplinger, Markus; Lindner, Paul Journal: ECS transactions Issue: Volume 86:Number 5(2018) Page Start: 145 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. 200 mm Ge Wafer Production for Oxide-Free Si-Ge Direct Wafer Bonding. (8th September 2020) Authors: Rebhan, Bernhard; Vanpaemel, Johannes; Dragoi, Viorel Journal: ECS transactions Issue: Volume 98:Number 4(2020) Page Start: 87 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Adhesive Wafer Bonding Using Ultra-Thin Spray-Coated BCB Layers. (8th September 2020) Authors: Rimböck, Johanna; Gasiorowski, Jacek; Pires, Mariana; Zenger, Tobias; Burggraf, Jürgen; Dragoi, Viorel Journal: ECS transactions Issue: Volume 98:Number 4(2020) Page Start: 67 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Conductive Semiconductor Interfaces Fabricated by Room Temperature Covalent Wafer Bonding. (24th August 2016) Authors: Flötgen, Christoph; Razek, Nasser; Dragoi, Viorel; Wimplinger, Markus Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 45 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Direct Wafer Bonding Methods: A Practical Process Selection Guide. (8th September 2020) Authors: Dragoi, Viorel; Rebhan, Bernhard; Pabo, Eric Journal: ECS transactions Issue: Volume 98:Number 4(2020) Page Start: 33 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Direct Wafer Bonding of GaN for Power Devices Applications. (20th July 2018) Authors: Dragoi, Viorel; Razek, Nasser; Guiot, Eric; Caulmilone, Raphael; Liao, Michael; Wang, Yekan Steven; Goorsky, Mark S.; Yates, Luke; Graham, Samuel Journal: ECS transactions Issue: Volume 86:Number 5(2018) Page Start: 23 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. High Efficiency Cleaning Processes for Direct Wafer Bonding. (24th August 2016) Authors: Dussault, Donald; Rothballer, Jan; Kurz, Florian; Reichardt, Make; Dragoi, Viorel Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 339 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. High Precision Low Temperature Direct Wafer Bonding Technology for Wafer-Level 3D ICs Manufacturing. (24th August 2016) Authors: Kurz, Florian; Plach, Thomas; Süss, Jürgen; Wagenleitner, Thomas; Zinner, Dominik; Rebhan, Bernhard; Dragoi, Viorel Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 345 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Low-Temperature Aluminum-Aluminum Wafer Bonding. (24th August 2016) Authors: Rebhan, Bernhard; Hinterreiter, Andreas; Malik, Nishant; Schjølberg-Henriksen, Kari; Dragoi, Viorel; Hingerl, Kurt Journal: ECS transactions Issue: Volume 75:Number 9(2016) Page Start: 15 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Si-Ge Heterostructures Fabricated by Room Temperature Wafer Bonding. (20th July 2018) Authors: Razek, Nasser; Dragoi, Viorel; Jung, Arik; von Känel, Hans Journal: ECS transactions Issue: Volume 86:Number 5(2018) Page Start: 191 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗