(Invited) High Accuracy Aligned Wafer Bonding for Wafer-Level Integration. (20th July 2018)

• Record Type: Journal Article
• Authors: Plach, Thomas; Rebhan, Bernhard; Dragoi, Viorel; Wagenleitner, Thomas; Wimplinger, Markus; Lindner, Paul
• Is Part Of: ECS transactions. Volume 86:Number 5(2018)
• Page Start: 145
• Page End: 158
• Publication Date: 2018-07-20
• Subjects: Electrochemistry -- Periodicals; Electrochemistry; Periodicals; Electronic journals; Electronic journal; 541.37
• DOI: 10.1149/08605.0145ecst
• Languages: English
• ISSNs: 1938-5862

Abstract

Abstract : This paper aims to present an overview of the existing wafer-to-wafer alignment technology. The development of optical alignment methods will be reviewed with respect to applications requirements evolution over time. An overview of the different factors contributing to the overall misalignment budget and how they are controlled now, or will be in the future, in order to meet the stringent requirements will be presented with examples.