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Author/Creator Deprat, F.

1. FDSOI bottom MOSFETs stability versus top transistor thermal budget featuring 3D monolithic integration. (November 2015)

Authors:
Fenouillet-Beranger, C.; Previtali, B.; Batude, P.; Nemouchi, F.; Cassé, M.; Garros, X.; Tosti, L.; Rambal, N.; Lafond, D.; Dansas, H.; Pasini, L.; Brunet, L.; Deprat, F.; Grégoire, M.; Mellier, M.; Vinet, M.
Journal:
Solid-state electronics
Issue:
Volume 113(2015)
Page Start:
2
Record Type:
Journal Article
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Available online (eLD content is only available in our Reading Rooms) ↗

3. Prediction of the evolution of defects induced by the heated implantation process: Contribution of kinetic Monte Carlo in a multi-scale modeling framework. (February 2023)

Authors:
Julliard, P.L.; Johnsson, A.; Zographos, N.; Demoulin, R.; Monflier, R.; Jay, A.; Er-Riyahi, O.; Monsieur, F.; Joblot, S.; Deprat, F.; Rideau, D.; Pichler, P.; Hémeryck, A.; Cristiano, F.
Journal:
Solid-state electronics
Issue:
Volume 200(2023)
Page Start:
Record Type:
Journal Article
View Content:
Available online (eLD content is only available in our Reading Rooms) ↗