1. Thermal management challenges and mitigation techniques for transistor-level 3-D integration. (September 2019) Authors: Iqbal, Md Arif; Macha, Naveen Kumar; Danesh, Wafi; Hossain, Sehtab; Rahman, Mostafizur Journal: Microelectronics journal Issue: Volume 91(2019) Page Start: 61 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗