1. A multi-scale approach to microstructure-sensitive thermal fatigue in solder joints. (August 2022) Authors: Xu, Yilun; Xian, Jingwei; Stoyanov, Stoyan; Bailey, Chris; Coyle, Richard J.; Gourlay, Christopher M.; Dunne, Fionn P.E. Journal: International journal of plasticity Issue: Volume 155(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗