1. Exploring Alternative Metals to Cu and W for Interconnects Applications Using Automated First-Principles Simulations. (18th November 2014) Authors: Sankaran, K.; Clima, S.; Mees, M.; Pourtois, G. Journal: ECS journal of solid state science and technology Issue: Volume 4:Number 1(2015) Page Start: N3127 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Exploring Alternative Metals to Cu and W for Interconnects Applications Using Automated First-Principles Simulations. (1st January 2015) Authors: Sankaran, K.; Clima, S.; Mees, M.; Pourtois, G. Journal: ECS journal of solid state science and technology Issue: Volume 4:Number 1(2015) Page Start: N3127 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Study of the Intrinsic Limitations of the Contact Resistance of Metal/Semiconductor Interfaces through Atomistic Simulations. (1st January 2018) Authors: Dabral, A.; Pourtois, G.; Sankaran, K.; Magnus, W.; Yu, H.; de Jamblinne de Meux, A.; Lu, A. K. A.; Clima, S.; Stokbro, K.; Schaekers, M.; Collaert, N.; Horiguchi, N.; Houssa, M. Journal: ECS journal of solid state science and technology Issue: Volume 7:Number 6(2018) Page Start: N73 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Study of the Intrinsic Limitations of the Contact Resistance of Metal/Semiconductor Interfaces through Atomistic Simulations. (25th May 2018) Authors: Dabral, A.; Pourtois, G.; Sankaran, K.; Magnus, W.; Yu, H.; de Jamblinne de Meux, A.; Lu, A. K. A.; Clima, S.; Stokbro, K.; Schaekers, M.; Collaert, N.; Horiguchi, N.; Houssa, M. Journal: ECS journal of solid state science and technology Issue: Volume 7:Number 6(2018) Page Start: N73 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗