Exploring Alternative Metals to Cu and W for Interconnects Applications Using Automated First-Principles Simulations. (18th November 2014)

• Record Type: Journal Article
• Authors: Sankaran, K.; Clima, S.; Mees, M.; Pourtois, G.
• Is Part Of: ECS journal of solid state science and technology. Volume 4:Number 1(2015)
• Page Start: N3127
• Page End: N3133
• Publication Date: 2014-11-18
• Subjects: Solid state chemistry -- Periodicals; Electronics -- Materials -- Periodicals; Electrochemistry -- Periodicals; 541.0421
• DOI: 10.1149/2.0181501jss
• Languages: English
• ISSNs: 2162-8777

Abstract

Abstract : The bulk properties of elementary metals and copper based binary alloys have been investigated using automated first-principles simulations to evaluate their potential to replace copper and tungsten as interconnecting wires in the coming CMOS technology nodes. The intrinsic properties of the screened candidates based on their cohesive energy and on their electronic properties have been used as a metrics to reflect their resistivity and their sensitivity to electromigration. Using these values, the 'performances' of the alloys have been benchmarked with respect to the Cu and W ones. It turns out that for some systems, alloying Cu with another element leads to a reduced tendency to electromigration. This is however done at the expense of a decrease of the conductivity of the alloy with respect to the bulk metal.