Author/Creator: Choi, Seungman - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Choi, Seungman

1. Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond. (19th November 2014)

Authors:: Gao, Shan; Smith, Ryan Scott; Cho, Jae Kyu; Choi, Seungman; Kannan, Sukeshwar; Chua, Engchye; Geisler, Holm; Kuechenmeister, Frank
Journal:: ECS journal of solid state science and technology
Issue:: Volume 4:Number 1(2015)
Page Start:: N3134
Record Type:: Journal Article
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2. Chip Packaging Interaction (CPI) with Cu Pillar Flip Chip for 20 nm Silicon Technology and Beyond. (1st January 2015)

Authors:: Gao, Shan; Smith, Ryan Scott; Cho, Jae Kyu; Choi, Seungman; Kannan, Sukeshwar; Chua, Engchye; Geisler, Holm; Kuechenmeister, Frank
Journal:: ECS journal of solid state science and technology
Issue:: Volume 4:Number 1(2015)
Page Start:: N3134
Record Type:: Journal Article
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3. Compensation of laser propagation effects within solids for high harmonic generation of extreme ultraviolet radiation. (January 2022)

Authors:: Kim, Yong Woo; Kim, Byunggi; Choi, Seungman; Nam, Han Ku; Kim, Hyunwoong; Kim, Young-Jin; Kim, Seung-Woo
Journal:: Optics & laser technology
Issue:: Volume 145(2022)
Page Start:
Record Type:: Journal Article
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4. Development of a bipolar electrostatic chuck module with a beam-array assembly using the multiple etching process. (8th November 2018)

Authors:: Choi, Seungman; Wakabayashi, Kazuki; Takahashi, Kunio; Saito, Shigeki
Journal:: Journal of micromechanics and microengineering
Issue:: Volume 28:Number 12(2018:Dec.)
Page Start:
Record Type:: Journal Article
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