1. A Cu–Pd–V System Filler Alloy for Silicon Nitride Ceramic Joining and the Interfacial Reactions. Issue 8 (28th June 2014) Authors: Xiong, Hua‐Ping; Chen, Bo; Pan, Yu; Zhao, Hai‐Sheng; Mao, Wei; Cheng, Yao‐Yong Journal: Journal of the American Ceramic Society Issue: Volume 97:Issue 8(2014) Page Start: 2447 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗