A Cu–Pd–V System Filler Alloy for Silicon Nitride Ceramic Joining and the Interfacial Reactions. Issue 8 (28th June 2014)

• Record Type: Journal Article
• Authors: Xiong, Hua‐Ping; Chen, Bo; Pan, Yu; Zhao, Hai‐Sheng; Mao, Wei; Cheng, Yao‐Yong
• Is Part Of: Journal of the American Ceramic Society. Volume 97:Issue 8(2014)
• Page Start: 2447
• Page End: 2454
• Publication Date: 2014-06-28
• Subjects: Ceramics -- Periodicals; 620.1405
• DOI: 10.1111/jace.13005
• Languages: English
• ISSNs: 0002-7820

Abstract

<abstract abstract-type="main" id="jace13005-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p>A Cu–Pd–V brazing alloy with the composition of Cu–(38.0~42.0)Pd–(7.0~10.0)V (in wt.%) was designed as a filler for joining Si₃N₄. Its wettability on Si₃N₄ ceramic was measured with the sessile drop method. It was shown that the Cu–Pd–V alloy gave a contact angle of 71° at 1473 K. The filler alloy was fabricated into foils with a thickness of 0.15 mm. The Si₃N₄–Si₃N₄ joints brazed at 1443 K for 10 min exhibit average three‐point bend strength of 263 MPa at room temperature, and the joint strengths at 973 K and 1073 K are 277 MPa and 218 MPa, respectively. The analysis results of SEM, XRD, and TEM for the brazed joint indicate the presence of V₂N at the surface of the Si₃N₄. The increase of the thickness of V₂N reaction layer obeyed parabolic law, and the parabolic rate constant (k) can be described as k = 2.8739 × 10⁻⁹ exp(−162989.4/RT) m²/s. Pd₂Si and Cu₃Pd compounds as well as (Cu, Pd) solid solution were detected in the central part of the joints. The presence of (Cu, Pd) phases and especially refractory Pd₂Si compounds within the joints should contribute to the stable high‐temperature property. The interfacial reaction mechanisms were discussed.</p> </abstract>