1. Atomic-Scale Investigation of Electromigration with Different Directions of Electron Flow into High-Density Nanotwinned Copper through In Situ HRTEM. (15th October 2021) Authors: Shen, Fang-Chun; Huang, Chih-Yang; Lo, Hung-Yang; Hsu, Wei-You; Wang, Chien-Hua; Chen, Chih; Wu, Wen-Wei Journal: Acta materialia Issue: Volume 219(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Characterization of Nanomechanical Properties and Scratch Hardness of (111) Nanotwinned Copper Thin Film in Ambient and Slurry Conditions. (1st June 2022) Authors: Sharma, Mohit; Chen, Chao-Chang A.; Chen, Chih; He, Pin-Syuan Journal: ECS journal of solid state science and technology Issue: Volume 11:Number 6(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Communication—Formation of Porous Cu3Sn by High-Temperature Current Stressing. (1st January 2016) Authors: Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. Journal: ECS journal of solid state science and technology Issue: Volume 5:Number 9(2016) Page Start: P461 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
4. Communication—Formation of Porous Cu3Sn by High-Temperature Current Stressing. (7th July 2016) Authors: Lin, C. K.; Chen, Chih; Chu, David T.; Tu, K. N. Journal: ECS journal of solid state science and technology Issue: Volume 5:Number 9(2016) Page Start: P461 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
5. Communication—Growth of <111> Nanotwinned Nickel Films on <111> Nanotwinned Cu Substrates. (1st January 2017) Authors: Chu, Yi-Cheng; Chen, Chih Journal: ECS journal of solid state science and technology Issue: Volume 6:Number 10(2017) Page Start: P715 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
6. Communication—Growth of <111> Nanotwinned Nickel Films on <111> Nanotwinned Cu Substrates. (3rd October 2017) Authors: Chu, Yi-Cheng; Chen, Chih Journal: ECS journal of solid state science and technology Issue: Volume 6:Number 10(2017) Page Start: P715 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
7. Effect of Electroplating Current Density on Tensile Properties of Nanotwinned Copper Foils. Issue 4 (1st April 2022) Authors: Fang, Chuan-Yu; Tran, Dinh-Phuc; Liu, Hung-Che; Ong, Jia-Juen; Lin, Yi-Quan; Hsu, Wei-You; Chen, Chih Journal: Journal of the Electrochemical Society Issue: Volume 169:Issue 4(2022) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
8. Effect of Sn grain orientation on formation of Cu6Sn5 intermetallic compounds during electromigration. (February 2017) Authors: Shen, Yu-An; Chen, Chih Journal: Scripta materialia Issue: Volume 128(2017) Page Start: 6 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
9. Effect of thermal stress on anisotropic grain growth in nano-twinned and un-twinned copper films. (March 2021) Authors: Tseng, I-Hsin; Hsu, Yun-Ting; Leu, Jihperng; Tu, K N; Chen, Chih Journal: Acta materialia Issue: Volume 206(2021) Page Start: Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
10. Electromigration Mechanism of Failure in Flip-Chip Solder Joints Based on Discrete Void Formation. Issue 1 (December 2017) Authors: Chang, Yuan-Wei; Cheng, Yin; Helfen, Lukas; Xu, Feng; Tian, Tian; Scheel, Mario; Di Michiel, Marco; Chen, Chih; Tu, King-Ning; Baumbach, Tilo Journal: Scientific reports Issue: Volume 7:Issue 1(2017) Page Start: 1 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗