1. Elastomeric Thermal Interface Materials with High Through‐Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking. (8th July 2014) Authors: Uetani, Kojiro; Ata, Seisuke; Tomonoh, Shigeki; Yamada, Takeo; Yumura, Motoo; Hata, Kenji Journal: Advanced materials Issue: Volume 26:Number 33(2014) Page Start: 5857 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗