Elastomeric Thermal Interface Materials with High Through‐Plane Thermal Conductivity from Carbon Fiber Fillers Vertically Aligned by Electrostatic Flocking. (8th July 2014)

• Record Type: Journal Article
• Authors: Uetani, Kojiro; Ata, Seisuke; Tomonoh, Shigeki; Yamada, Takeo; Yumura, Motoo; Hata, Kenji
• Is Part Of: Advanced materials. Volume 26:Number 33(2014)
• Page Start: 5857
• Page End: 5862
• Publication Date: 2014-07-08
• Subjects: Materials -- Periodicals; Chemical vapor deposition -- Periodicals; 620.11
• DOI: 10.1002/adma.201401736
• Languages: English
• ISSNs: 0935-9648

Abstract

<abstract abstract-type="graphical" xml:lang="en" id="adma201401736-abs-0001"> <title> <x xml:space="preserve">Abstract</x> </title> <p> <bold>Electrostatic flocking</bold> is applied to create an array of aligned carbon fibers from which an elastomeric thermal interface material (TIM) can be fabricated with a high through‐plane thermal conductivity of 23.3 W/mK. A high thermal conductivity can be achieved with a significantly low filler level (13.2 wt%). As a result, this material retains the intrinsic properties of the matrix, i.e., elastomeric behavior. <boxed-text content-type="graphic" position="anchor" orientation="portrait"><graphic position="anchor" mimetype="image" xlink:href="ark:/27927/pgh1302tv29" orientation="portrait" xlink:type="simple" xmlns:xlink="http://www.w3.org/1999/xlink" /></boxed-text></p> </abstract>