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1. A Comparison of Surface Passivation Techniques for Measurement of Minority Carrier Lifetime in Thin Si Wafers: Toward a Stable and Uniform Passivation. Issue 1670 (17th June 2014)

4. Surface Damage Introduced by Diamond Wire Sawing of Si Wafers: Measuring in-depth and the Lateral Distributions for Different Cutting Parameters. Issue 1770 (2015)