Author/Creator: Akolkar, Rohan - British Library Electronic Legal Deposit Catalogue-Journal Issues and Articles Search Results

Author/Creator Akolkar, Rohan

21. Electrochemical Atomic Layer Etching of Ruthenium. Issue 6 (14th April 2020)

Authors:: Gong, Yukun; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 167:Issue 6(2020)
Page Start:
Record Type:: Journal Article
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22. Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers. Issue 14 (1st January 2015)

Authors:: Miller, Alexander; Yu, Lu; Blickensderfer, Jacob; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 162:Issue 14(2015)
Page Start:: D630
Record Type:: Journal Article
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23. Electrochemical Copper Metallization of Glass Substrates Mediated by Solution-Phase Deposition of Adhesion-Promoting Layers. Issue 14 (27th October 2015)

Authors:: Miller, Alexander; Yu, Lu; Blickensderfer, Jacob; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 162:Issue 14(2015)
Page Start:: D630
Record Type:: Journal Article
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24. Electrodeposition of Neodymium from NdCl3-Containing Eutectic LiCl–KCl Melts Investigated Using Voltammetry and Diffusion-Reaction Modeling. Issue 8 (1st January 2017)

Authors:: Shen, Dai; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 164:Issue 8(2017)
Page Start:: H5292
Record Type:: Journal Article
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25. Electrodeposition of Neodymium from NdCl3-Containing Eutectic LiCl–KCl Melts Investigated Using Voltammetry and Diffusion-Reaction Modeling. Issue 8 (7th July 2017)

Authors:: Shen, Dai; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 164:Issue 8(2017)
Page Start:: H5292
Record Type:: Journal Article
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26. Electroless Deposition of Copper-Manganese for Applications in Semiconductor Interconnect Metallization. Issue 8 (1st January 2016)

Authors:: Yu, Lu; Vashaei, Zahra; Ernst, Frank; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 163:Issue 8(2016)
Page Start:: D374
Record Type:: Journal Article
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27. Electroless Deposition of Copper-Manganese for Applications in Semiconductor Interconnect Metallization. Issue 8 (24th May 2016)

Authors:: Yu, Lu; Vashaei, Zahra; Ernst, Frank; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 163:Issue 8(2016)
Page Start:: D374
Record Type:: Journal Article
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28. Electro–Oxidation of Nitroxide Radicals: Adsorption–Mediated Charge Transfer Probed Using SERS and Potentiometry. Issue 5 (1st May 2022)

Authors:: Shaheen, Nora A.; Dean, William; Penley, Drace; Kersten, Bethany; Rintamaki, Jacob; Vukmirovic, Miomir B.; Gurkan, Burcu E.; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 169:Issue 5(2022)
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Record Type:: Journal Article
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29. Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of an Electrolyte Additive in Zinc Electrodeposition. Issue 13 (16th August 2019)

Authors:: Liu, Xinyu; Bolton, Onas; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 166:Issue 13(2019)
Page Start:: D583
Record Type:: Journal Article
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30. Experimental and Modeling Studies of the Hysteresis Behavior and Dendrite Suppression Efficacy of an Electrolyte Additive in Zinc Electrodeposition. Issue 13 (1st January 2019)

Authors:: Liu, Xinyu; Bolton, Onas; Akolkar, Rohan
Journal:: Journal of the Electrochemical Society
Issue:: Volume 166:Issue 13(2019)
Page Start:: D583
Record Type:: Journal Article
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