1. Experimental characterisation of coaxial TSV transistor keep out zones. (1st October 2018) Authors: Adamshick, Stephen; Northrup, Steven; Liehr, Michael Journal: Micro & nano letters Issue: Volume 13:Number 10(2018) Page Start: 1457 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
2. Experimental characterization of coaxial through silicon vias for 3D integration. Issue 5 (May 2015) Authors: Adamshick, Stephen; Coolbaugh, Douglas; Liehr, Michael Journal: Microelectronics journal Issue: Volume 46:Issue 5(2015) Page Start: 377 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗
3. Fabrication method for annular/shielded copper interconnects. (1st May 2017) Authors: Adamshick, Stephen; Burke, John; Liehr, Michael Journal: Micro & nano letters Issue: Volume 12:Number 5(2017) Page Start: 301 Record Type: Journal Article View Content: Available online (eLD content is only available in our Reading Rooms) ↗